PURPOSE: A semiconductor package is provided to wirelessly transmit signals between a substrate and semiconductor chips, thereby improving data processing speed to high speed. CONSTITUTION: A semiconductor package comprises a substrate and a semiconductor chip. The semiconductor chip wirelessly transmits and receives a signal with the substrate on the substrate. The substrate comprises a substrate wireless signal part(40). The substrate wireless signal part transmits a wireless signal to the semiconductor chip and receives the wireless signal from the semiconductor chip. The semiconductor chip comprises a chip wireless signal part(110). The chip wireless signal part transmits the wireless signal to the substrate and receives the wireless signal from the substrate.
