发明名称 SEMICONDUCTOR CHIP
摘要 PURPOSE: A semiconductor chip is provided to test whether a penetrating electrode and a circuit layer are electrically connected or not by arranging a test pad part which is connected to the penetrating electrode and the circuit layer on the other side of a semiconductor substrate. CONSTITUTION: A semiconductor chip body comprises a semiconductor substrate and a circuit layer(114). The semiconductor substrate has one side and the other side which faces to the one side. The circuit layer is formed on the one side of the semiconductor substrate. A penetrating electrode is formed in order to pass through the one side from the other side of the semiconductor substrate. A test pad part tests whether the circuit layer is normally operated or not and whether the penetrating electrode and the circuit layer are electrically connected or not.
申请公布号 KR20110137524(A) 申请公布日期 2011.12.23
申请号 KR20100057512 申请日期 2010.06.17
申请人 HYNIX SEMICONDUCTOR INC. 发明人 KIM, JONG HOON;SUH, MIN SUK;HAN, KWON WHAN;YANG, SEUNG TAEK
分类号 H01L21/60;H01L21/66 主分类号 H01L21/60
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