| 摘要 |
PURPOSE: A die bonder and a pickup method and a pickup device are provided to exfoliate a die completely by picking up a dicing film and forming an exfoliation time, and then exfoliating the die from the dicing film. CONSTITUTION: In a die bonder and a pickup method and a pickup device, a work supply unit(2) comprises a stack loader(21), a frame feeder(22), and an unloader(23). The die bonding portion(3) comprises a preform part(31) and a bonding head part(32). The bonding head part picks up a die from the pickup device(12). The wafer supply portion(1) comprises a wafer cassette lifter(11) and the pickup device. The wafer cassette lifter successively supplies the wafer ring to the pickup device. The pickup device comprises an expanded ring supporting the wafer ring.
|
