| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure which suppresses deterioration of humidity resistance and improves heat resistance of a semiconductor device. <P>SOLUTION: The semiconductor device includes semiconductor elements 1a and 1b mounted on a heat spreader 3, lead frames 5a and 5b, which respectively connect to the semiconductor elements 1a and 1b, and a mold resin 6 holding the lead frames 5a and 5b and forming a case. Upper portions and side surfaces of the semiconductor elements 1a and 1b are covered by an organic thin film 8 formed between the semiconductor elements 1a and 1b and the mold resin 6. <P>COPYRIGHT: (C)2012,JPO&INPIT |
