| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide vacuum tweezers capable of stably absorbing a semiconductor wafer with warpage. <P>SOLUTION: Vacuum tweezers 1 comprise: a long body 2; an end portion 3 having a flat part; and a plurality of salients 4 provided on the flat part 3a of the end portion 3. At least one of the salients 4 is an absorber 4 composed of a material with flexibility. <P>COPYRIGHT: (C)2012,JPO&INPIT |
