| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device with no burr in a conductive member. <P>SOLUTION: A semiconductor device comprises a wiring board 2, a semiconductor chip 3 having a functional face 3a on which a functional element 4 is formed and bonded and electrically connected to the wiring board 2 such that the functional face 3a faces one surface of the wiring board 2 keeping a predetermined distance from the one surface, a conductive film 6 formed on the one surface of the wiring board 2 and having an end face substantially flush with an end face 2e of the wiring board 2, and an encapsulation resin layer 7 formed between the wiring board 2 and the semiconductor chip 3 and on the conductive film 6. A face of the semiconductor chip 3 opposite to the functional face 3a is exposed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
