| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an embedded substrate. <P>SOLUTION: A method for manufacturing an embedded substrate, which comprises a core substrate formed with a pattern on both surfaces thereof and formed with a cavity penetrating from an upper part thereof to a lower part thereof, a chip embedded in the cavity, and a first insulator and a second insulator provided respectively on both surfaces of the core substrate so as to protect the pattern, includes: preparing the core substrate; laminating the first insulator on a lower surface of the core substrate so as to cover a lower side of the cavity; forming an adhesive layer on the first insulator that is exposed through the cavity; embedding the chip in the cavity by attaching the chip on the adhesive layer; and laminating the second insulator on an upper surface of the core substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
