| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a solder plated wire lowered in proof stress. <P>SOLUTION: A plating pretreatment means, a molten solder plating tank 62 as a plating means 61 in which solder plating is applied to the surface of a copper wire 1a, and a winding means 71 for winding copper wires 1a, 1b having the plated surfaces are arranged in series in this order from the upstream side along the traveling direction of the copper wires 1a, 1b. The proof stress of the copper wire 1a is lowered by a softening/annealing means 51 provided in the plating pretreatment means, and the copper wires 1a, 1b having lowered proof stress are wound by the winding means 71 by a winding force lower than the proof stress of the copper wires 1a, 1b, and a direction changing roller for changing the traveling direction of the copper wire 1b is configured of a tank upper direction changing roller 65 provided at the upside of the molten solder plating tank 62 for changing the traveling direction of the copper wire 1b after making the molten solder plating tank 62 pass to the side of the winding means, and the tank upper direction changing roller 65 is arranged in a higher position than the arrangement height of a winding means upstream side arrangement roller 73A arranged at the upstream of the winding means 71. <P>COPYRIGHT: (C)2012,JPO&INPIT |
