发明名称 LED PACKAGE DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED package device capable of preventing color shift by using resin molds. <P>SOLUTION: An LED package device comprises: at least three or more LEDs 2R, 2B, and 2G having different wavelengths; and a lead frame 1 on which the LEDs 2R, 2B, and 2G are mounted. The lead frame 1 includes a cup portion 5 in which the LEDs 2R, 2B, and 2G are mounted. Inside the cup portion 5 where the LEDs 2R, 2B, and 2G are mounted, a first resin mold 11 having light transmissivity is arranged so as to cover the LEDs 2R, 2B, and 2G thus mounted. A second resin mold 12 having light transmissivity is formed so as to cover at least an opening of the cup portion 5. The first resin mold 11 and the second resin mold 12 have refractive indices different from each other. In this way, the LED package device can effectively prevent color shift and exhibits excellent color reproducibility when it is used in a color display, etc. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012023189(A) 申请公布日期 2012.02.02
申请号 JP20100159650 申请日期 2010.07.14
申请人 IWATANI INTERNATL CORP;MITSUBISHI ELECTRIC CORP 发明人 ABE OSAMU;TERANISHI MASATO
分类号 H01L33/56 主分类号 H01L33/56
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