发明名称 RESIN MOLDING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin molding apparatus which prevents heat from diffusing to an apparatus adjacent to a preheating part, and increase the temperature to a preheating temperature efficiently in a short time. <P>SOLUTION: A preheating apparatus 28 stops a heater block 13 with a molded product 1 placed thereon in a tunnel cover 14 installed at a preheating position R while the heater block 13 is transferred from a receiving position P to a delivery position Q by a transfer mechanism 29, and preheats the molded product 1 intensively. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012020446(A) 申请公布日期 2012.02.02
申请号 JP20100158965 申请日期 2010.07.13
申请人 APIC YAMADA CORP 发明人 KANAI EIJI
分类号 B29C45/14;B29C43/18;B29C43/52;B29C45/02;H01L21/56 主分类号 B29C45/14
代理机构 代理人
主权项
地址