DOPING MINOR ELEMENTS INTO METAL BUMPS

摘要

PURPOSE: Doping minor elements into metal bumps are provided to improve manufacturing costs and the property of a metal pump by adding some elements of a plurality of types. CONSTITUTION: In doping minor elements into metal bumps, a wafer including a substrate(10) is provided. A semiconductor device(14) is formed in the surface of the substrate. An interconnect structure(12) is electrically combined with the semiconductor device. The interconnect structure comprises an inter-layer dielectric and an inter-metal dielectric. A metal pad(28) is formed on the interconnect structure.