| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a tape carrier substrate which prevents disconnection of output conductor wiring. <P>SOLUTION: The semiconductor device comprises a tape carrier substrate and a semiconductor element 8. The tape carrier substrate includes first and second terminal parts 2A, 2B respectively provided on edge portions of a tape carrier base material 1 and respectively having a first and second plurality of terminals 2a, 2b arranged in a first direction W. The tape carrier substrate further includes first and second wiring parts 3A, 3B provided on the tape carrier base material 1 and respectively having first and second conductor wiring 3a, 3b respectively connected to the first and second terminals 2a, 2b. A plurality of slits 7 are provided on the tape carrier base material 1 between the first wiring part 3A and the second terminal part 2B, and arranged in the first direction W each extending in a second direction L. Each of distances S2l, S2r from the slits 7 arranged on the both ends among the plurality of slits 7 to respective both ends of the tape carrier base material 1 in the first direction W is larger than a distance S1 between the slits 7 arranged next to each other among the plurality of slits 7. <P>COPYRIGHT: (C)2012,JPO&INPIT |
