THERMOSETTING RESIN COMPOSITION, AND CURED FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which can inhibit that a crack generates in the thermosetting resin composition at the time of grinding, and further can make a relative dielectric constant after thermosetting low in the thermosetting resin composition which is prepared so as to cover a bump electrode of a semiconductor wafer having the bump electrode at the back surface, and is used in order to expose the bump electrode by carrying out grinding after performing the heat curing treatment.

SOLUTION: The thermosetting resin composition includes: a cyclic olefin resin of acid curability (A); and an acid generator (B) which generates acid with light or heat.

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