| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film forming method and a film forming device thereof using arc ion plating, capable of accurately detecting a particle during film formation and managing the particle contained in the film by appropriate process management matching to variations in the particle generation amount. <P>SOLUTION: The film forming device includes: a case 5 having an opening 51 that leads to a body of a vacuum furnace 1 at one end, whose other end is closed; and a particle detection unit 6 attached to the other end of the case 5. The case 5 is arranged so that part of a target surface is positioned on an extension of the shaft center, and is configured such that the ratio (L/D) of the distance L between a reference point 60 and the opening 51 to the minimum opening diameter D of the opening 51 is 12 to 30. <P>COPYRIGHT: (C)2012,JPO&INPIT |
