| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a light-emitting device which can increase the brightness of the light-emitting device. <P>SOLUTION: A method for manufacturing a light-emitting device in which a light-emitting device wafer having areas each having a light-emitting circuit formed therein partitioned by a plurality of scheduled dividing lines formed on its surface in a lattice form is divided into individual light-emitting devices, comprises the steps of: dividing the light-emitting device wafer along the scheduled dividing lines; thereafter, grinding a back side of the divided light-emitting device wafer to reduce the thickness thereof to a finished thickness of the light-emitting device; and thereafter, cutting the divided light-emitting device wafer from the back side thereof along the scheduled dividing lines by a cutting blade to form a chamfer part at an outer circumference edge of the back side of the individual light-emitting device. <P>COPYRIGHT: (C)2012,JPO&INPIT |
