| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a die-bonding material for an optical semiconductor device of high thermal conductivity which can restrain cracks from being generated in an optical semiconductor device using a die-bonding material. <P>SOLUTION: A die-bonding material for an optical semiconductor device of the present invention comprises: a first silicone resin having a hydrogen atom bonded to a silicon atom; a second silicon resin having an alkenyl group without having a hydrogen atom bonded to a silicon atom; a catalyst for hydrosilylation reaction; and at least one of magnesium carbonate anhydrous salt containing no crystal water, represented by the formula MgCO<SB POS="POST">3</SB>and a coated bodies composed of the magnesium carbonate anhydrous salt the surface of which is coated with organic resin, silicone resin or a silica. <P>COPYRIGHT: (C)2012,JPO&INPIT |
