| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a system and method for attaching an inertial sensor on a plate. <P>SOLUTION: A sensor package includes substrate layers 32 and 34, a sensor layer 24, insulation layers 26 and 28 disposed between the sensor layer 24 and the substrate layers 32 and 34, and a V groove formed in the substrate layers 32 and 34 by anisotropic etching. The substrate layers 32 and 34 are in 100 crystal face orientation. Thereafter, the sensor package is removed from a wafer, and the surface of the substrate layer 32 or 34 formed by the etching is attached to the plate. In one embodiment, three sensor packages are attached to the plate so that their detection axes are perpendicular to each other. <P>COPYRIGHT: (C)2012,JPO&INPIT |
