| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique which detects that a circuit disposed on the front side of a semiconductor substrate is analyzed from the rear side of the semiconductor substrate. <P>SOLUTION: A semiconductor integrated circuit device includes: a semiconductor substrate having a first surface having a circuit block disposed thereon and a second surface opposite to the first surface; a mounting substrate having the semiconductor substrate mounted thereon; a conductive pattern disposed in an area overlapping a part to be protected of the circuit block, of the mounting substrate; and a detection circuit for detecting that the conductive pattern has been modified. The semiconductor substrate is mounted on the mounting substrate so that the second surface of the semiconductor substrate and the mounting substrate face each other. <P>COPYRIGHT: (C)2012,JPO&INPIT |
