发明名称 APPARATUS TO BE USED AS DOUBLE-SIDED SENSOR PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To provide a sensor package of a surface mounting application. <P>SOLUTION: The sensor package includes a first device (122) fixed on an upper surface (116), a second device (124) fixed on a lower surface (118) and a lead for preventing electrical connection with an external circuit of a housing. The lead has an end part in the vicinity of a side part of a lead frame (104) in which connection pads (126, 128) are arranged on the upper surface (116) and the lower surface (118). The end part receives connection such as wire bonding from the connection pads (126, 128) so that the first device (122) and the second device (124) are connected independently of the external connection of the sensor package. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012058243(A) 申请公布日期 2012.03.22
申请号 JP20110195530 申请日期 2011.09.08
申请人 GENERAL ELECTRIC CO <GE> 发明人 KIM WOOJIN;ANIELA BURISEK;JOAN DONCASTER;KIM DON-SUK
分类号 G01L19/14;G01D21/02;G01P1/02;G01P15/08;H01L29/84 主分类号 G01L19/14
代理机构 代理人
主权项
地址