| 摘要 |
PURPOSE: A transfer molding apparatus is provided to increase the efficiency of a molding progress for packaging by minimizing process errors generated when a release film is mounted on. CONSTITUTION: An upper mold(100) includes a substrate settling part on which a packaging target circuit substrate is settled. A lower mold(200) includes a filling space in which an encapsulating material for packaging is filled. A plunger(400) is installed at a lower part of the filling space of the lower mold to be lifted and dropped upward and downward. A port block(300) fixes a circumference of a release film mounted on an upper side of the lower mold. The port block is installed at the lower mold using an elastic member.
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