发明名称 |
Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate |
摘要 |
A semiconductor device has a first substrate with a central region. A plurality of bumps is formed around a periphery of the central region of the first substrate. A first semiconductor die is mounted to the central region of the first substrate. A second semiconductor die is mounted to the first semiconductor die over the central region of the first substrate. A height of the first and second die is less than or equal to a height of the bumps. A second substrate has a thermal conduction channel. A surface of the second semiconductor die opposite the first die is mounted to the thermal conductive channel of the second substrate. A thermal interface layer is formed over the surface of the second die. The bumps are electrically connected to contact pads on the second substrate. A conductive plane is formed over a surface of the second substrate. |
申请公布号 |
US8143108(B2) |
申请公布日期 |
2012.03.27 |
申请号 |
US20100965584 |
申请日期 |
2010.12.10 |
申请人 |
PENDSE RAJENDRA D.;STATS CHIPPAC, LTD. |
发明人 |
PENDSE RAJENDRA D. |
分类号 |
H01L23/373 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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