发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To form an oxide tantalum-based film having a favorable step-coating property while suppressing an oxygen concentration in the film. <P>SOLUTION: A conductive oxide and nitride tantalum film lacking in oxygen with respect to tantalum and nitrogen stoichiometrically is formed on a substrate by alternately repeating, a plurality of times: a process in which a raw material gas and a nitriding agent are fed into a treatment chamber accommodated with the substrate under a condition that a CVD reaction is generated, and a nitride tantalum layer is formed on the substrate; and a process in which an oxidizing agent is fed into the treatment chamber to oxidize the nitride tantalum layer under a condition that an oxidization reaction caused by the oxidizing agent of the nitride tantalum layer is unsaturated. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012062569(A) |
申请公布日期 |
2012.03.29 |
申请号 |
JP20110131509 |
申请日期 |
2011.06.13 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
HARADA KAZUHIRO;ITAYA HIDEJI |
分类号 |
C23C16/40;C23C16/18;C23C16/34;H01L27/105;H01L45/00;H01L49/00 |
主分类号 |
C23C16/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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