| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lower profile, higher function multilayer substrate having a higher degree of freedom in design, and to provide a method of manufacturing the same. <P>SOLUTION: A multilayer substrate 11 comprises: a core substrate 2; and a first resin layer 12 formed on one main surface 3 of the core substrate 2. A first package component 10 is mounted on a surface conductor formed on the main surface 3 which comes into contact with the core substrate 2 of the first resin layer 12. A second package component 20 is mounted on a surface conductor 35a formed on the main surface 23 facing the main surface 3 which comes into contact with the core substrate 2 of the first resin layer 12. The first package component 10 and the second package component 20 are buried in the first resin layer 12. <P>COPYRIGHT: (C)2012,JPO&INPIT |
