| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module which enables a number of control terminals to be formed therein and reduces the size of the module. <P>SOLUTION: A semiconductor module 1 includes multiple semiconductor elements 2 (2a, 2b, and 2c), power terminals 4, control terminals 5, and a sealing member 3. Each power terminal 4 is composed of a metal plate and electrically connects with the semiconductor elements 2a and 2b. Further, the control terminals 5 electrically connect with the semiconductor elements 2a and 2c. The sealing member 3 seals the semiconductor elements 2 and part of the power terminals 4 and the control terminals 5. An insulation film 6 is provided on a main surface of each power terminal 4, and the control terminals 5 are formed on a surface 60 of the insulation film 6, which is located on the side opposite to the power terminal 4. <P>COPYRIGHT: (C)2012,JPO&INPIT |
