| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus advantageous to miniaturization, and also to provide a manufacturing method thereof. <P>SOLUTION: An imaging apparatus of the embodiment includes: a semiconductor substrate 11 with multiple pixels 6 arranged thereon; a transparent substrate 17 including first through electrodes 23 arranged in previously penetrated openings (17a, 17b); second through electrodes 22 exposed on the pixels and connected to the first through electrodes 23; an adhesive material 16 for performing adhesion between the semiconductor substrate 11 and the transparent substrate 17; and an imaging lens part 26 arranged on the transparent substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
