| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, for serving to marking, having an excellent laser marking property and enabling easy and clear discrimination of the type, producer, etc. of a semiconductor device, and to provide the semiconductor device sealed using the same. <P>SOLUTION: The resin composition for sealing the semiconductor, which is made into a molding which absorbs light and emits light, contains at least an epoxy resin, a curing agent, an inorganic filler, a curing catalyst, and a light storage phosphor. <P>COPYRIGHT: (C)2012,JPO&INPIT |
