| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multi-chamber substrate processing apparatus that can implement high processing efficiency. <P>SOLUTION: The substrate processing apparatus which has a storage section 1 for storing a wafer W, a transfer chamber 41 connected to a plurality of surrounding chambers 42, 43 for processing the wafer W in an airtight state and provided therein with a transfer arm A41 for transferring the wafer W to and from the chambers 42, 43, and a transfer chamber 51 provided therein with a transfer arm A51 for transferring the wafer W to and from chambers 52, 53, and which loads the wafer W into the transfer chamber 41 through a first opening 410, includes an unloading chamber 6 for unloading the wafer W ejected through a second opening 60 disposed in a different position from the first opening 410 to the storage section 1 by means of a transfer arm A6, a horizontal moving section X6, a vertical moving section Z6 and a parallel moving section 63. <P>COPYRIGHT: (C)2012,JPO&INPIT |
