发明名称 SUBSTRATE FOR SUSPENSION, METHOD OF MANUFACTURING SUBSTRATE FOR SUSPENSION, SUSPENSION, SUSPENSION WITH ELEMENT, AND HARD DISK DRIVE
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate for suspension that exhibits excellent slider mounting performance and prevents a solder-caused short circuit. <P>SOLUTION: A substrate for suspension includes: a metal substrate; a base insulating layer formed on the metal substrate; and a conductor layer formed on the insulating layer and having at least connection wiring for connecting a slider mounting area and an external terminal part placed at an end opposite to the slider mounting area. A via made up of a conductive material filled in a though-hole formed in the insulating layer and connecting the metal substrate and wiring for the via is formed in the slider mounting area. A solder pad for connecting the connection wiring or the wiring for the via with a slider through solder is formed on the conductor layer in the slider mounting area. In addition, a dry film resist layer placed on the conductor layer and formed so as to surround the solder pad is placed in the mounting area. The resist layer has film thickness thicker than that of the via, and the slider is placed on the resist layer so as to keep parallel to the metal substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012074092(A) 申请公布日期 2012.04.12
申请号 JP20100216118 申请日期 2010.09.27
申请人 DAINIPPON PRINTING CO LTD 发明人 YAMAZAKI TAKESHI;ONUKI MASAO;MIURA YOICHI
分类号 G11B5/60;G11B21/21 主分类号 G11B5/60
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