| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer-level image sensor module which can improve the productivity and also the reliability by facilitating the wiring process for external connection such as a via and which can achieve focus non-adjustment when the module is applied to a camera module, a manufacturing method for the wafer-level image sensor module, and a camera module. <P>SOLUTION: An image sensor module comprises: a wafer 11; an image sensor 12 mounted on a top surface of the wafer 11; a transparent member 13 provided on the top surface of the wafer 11 so as to seal the image sensor 12; a via 14 formed to locate at a region on the wafer 11 and outside the transparent member 13; a top-surface pad 15 formed at an upper end of the via 14; a capsulation part 16 formed on the region outside the transparent member 13 on the top surface of the wafer 11; and an external connection member 18 electrically connected to a lower end of the via 14. <P>COPYRIGHT: (C)2012,JPO&INPIT |
