| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a connection terminal structure and a manufacturing method therefor, capable of reducing wiring impedance through the connection terminal with a simple structure, and a socket having the connection terminal structure, for electrically connecting a connection object such as a semiconductor package to a mounting substrate etc. <P>SOLUTION: The connection terminal structure includes: a substrate having a plurality of pads formed on the surface; a plurality of connection terminals each having a connection portion to be in contact with the connection object on one end and a plate-like fixation portion on another end, in which a first surface of the fixation portion is bonded to each pad; and an electronic component having two electrode terminals. The electronic component is mounted in such a manner that each electrode terminal is disposed on a surface opposite to the first surface of each fixation portion of mutually adjacent connection terminals. <P>COPYRIGHT: (C)2012,JPO&INPIT |
