| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable improvement of current supply capacity of an internal power supply circuit without increasing a layout area of a semiconductor device. <P>SOLUTION: A semiconductor device comprises: a main region 12; a plurality of first power supply wiring 15 formed in the main region along a first direction; a plurality of second power supply wiring 16 that are formed in the main region along a second direction so as to cross and be electrically connected to the first power supply wiring; first internal power supply circuits 17 that are provided in a first adjacent region 13 adjacent to one side of the main region in the first direction and are each connected to one ends of the first power supply wiring; and a second internal power supply circuit 18 that is provided in a second adjacent region 14 adjacent to one side of the main region in the second direction and is connected to one end of the power supply wiring in the plurality of second power supply wiring closest to the other end of the first power supply wiring. <P>COPYRIGHT: (C)2012,JPO&INPIT |
