发明名称 RESIST INK PRINTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a resist ink printing device, and more particularly, to provide the resist ink printing device capable of selectively discharging resist ink to lead-in wires for gold plating on a substrate. <P>SOLUTION: The resist ink printing device comprises: a transfer part which transfers a substrate on which lead-in wires for electrolytic gold plating are patterned into a main body; a controller formed on the main body which measures a warpage degree of the substrate, recognizes a gerber file stored with circuit diagram information of the substrate, compensates for the warpage degree of the substrate and corrects the gerber file; and at least one inkjet printing head part which discharges photosensitivity resist ink to the lead-in wires by the corrected gerber file. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012099795(A) 申请公布日期 2012.05.24
申请号 JP20110195855 申请日期 2011.09.08
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KWON JI HAN;YANG JU HWAN;KIM JUN-YANG;SONG HA YOON;KIM JAE HUN;PARK HEE JIN;YOO YOUNG SEUCK;CHO SUNG NAM
分类号 H05K3/28 主分类号 H05K3/28
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