摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resist ink printing device, and more particularly, to provide the resist ink printing device capable of selectively discharging resist ink to lead-in wires for gold plating on a substrate. <P>SOLUTION: The resist ink printing device comprises: a transfer part which transfers a substrate on which lead-in wires for electrolytic gold plating are patterned into a main body; a controller formed on the main body which measures a warpage degree of the substrate, recognizes a gerber file stored with circuit diagram information of the substrate, compensates for the warpage degree of the substrate and corrects the gerber file; and at least one inkjet printing head part which discharges photosensitivity resist ink to the lead-in wires by the corrected gerber file. <P>COPYRIGHT: (C)2012,JPO&INPIT |