发明名称 Semiconductor device and method of manufacturing the same
摘要 A semiconductor device having first and second stacks formed successively over a common substrate, in which the first stack that remains after removing the second stack comprises a field effect transistor, the second stack that is stacked over the first stack comprises a device different from the field effect transistor, and the first stack comprising the field effect transistor has an etching stopper layer that defines a stopping position of a recess formed in the first stack and comprises InGaP, a lower compound semiconductor layer that is disposed below a gate electrode disposed in the recess and comprises AlGaAs, and a spacer layer that is interposed between the etching stopper layer and the lower compound semiconductor layer for preventing phosphorus contained in the etching stopper layer from thermally diffusing as far as the lower compound semiconductor layer and chemically bonding with constituents elements of the lower compound semiconductor layer.
申请公布号 US2012126288(A1) 申请公布日期 2012.05.24
申请号 US201113317849 申请日期 2011.10.31
申请人 BITO YASUNORI;RENESAS ELECTRONICS CORPORATION 发明人 BITO YASUNORI
分类号 H01L27/06;H01L21/28 主分类号 H01L27/06
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