| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a piezoelectric element in which occurrence of cracking can be prevented. <P>SOLUTION: A cut groove CH1 is formed in a piezoelectric element substrate 2 and a first tape 11 in a piezoelectric element substrate cutting step S4, and a second tape 12 is stuck to the second surface 2b of the piezoelectric element substrate 2 in a second sticking step S6. Consequently, when ultraviolet rays are irradiated from the first tape 11 side in an ultraviolet ray irradiation step S7, the ultraviolet rays are not shielded by the piezoelectric element substrate 2 but passed through the cut groove CH1, and the second adhesive layer 12a of the second tape 12 is irradiated with the ultraviolet rays. The part of the second adhesive layer 12a irradiated with the ultraviolet rays becomes an adhesive force reduction part 12b where the adhesive force is reduced. Since the surface of the adhesive force reduction part 12b is not processed in the piezoelectric element substrate cutting step S4, it is not roughened but is smooth and the adhesive force is reduced. Consequently, a resin 5 can be peeled off easily from the second tape 12 in a second peeling step S11. <P>COPYRIGHT: (C)2012,JPO&INPIT |
