| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED bulb capable of promoting heat dissipation from LED chips. <P>SOLUTION: The LED bulb includes a plurality of LED chips 201, an LED substrate 300 having a mounting face 301 for supporting the plurality of LED chips 201, and a heat transfer bracket 400 with the LED substrate 300 attached. The heat transfer bracket 400 has a heat dissipation through-hole 422 formed in a region where the LED substrate 300 is not attached. <P>COPYRIGHT: (C)2012,JPO&INPIT |
