| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an optical semiconductor device having a sufficiently high productivity as well as an optical semiconductor device provided by the manufacturing method. <P>SOLUTION: A manufacturing method of an optical semiconductor device 500 includes a light emitting element 305, a sealing material 510 for sealing the light emitting element 305, and an optical element 580 having a surface with a prescribed shape adhered to the sealing material 510. In the method, in a state that the optical element 580 is placed on the surface of a resin composition 315 which contains photopolymerizable compound, being submerged with the light emitting element 305, and can cure only with irradiation of light, the resin composition 315 is exposed through the optical element 580 to obtain the sealing material 510 which is an optically transparent cured material of the resin composition 315, of which surface tightly contacting the surface comes to be an outgoing surface of the light emitted from the light emitting element 580 in the sealing material 510 at a surface opposed to the surface with prescribed shape in the optical element 580. <P>COPYRIGHT: (C)2012,JPO&INPIT |
