| 摘要 |
<P>PROBLEM TO BE SOLVED: To form a finger wiring pattern 71a to be a thick film (high aspect ratio) when forming finger wiring patterns 71a, 71b intersecting a bus wiring pattern 73a on a principal surface of a substrate 9 and prevent end thickening 3 and end thinning 4 of the finger wiring patterns 71a, 71b from occurring on an exposed surface of the substrate 9. <P>SOLUTION: When a first nozzle 47 relatively moving with respect to a substrate 9 while discharging a paste 7 for forming a first finger wiring pattern 71a by coating reaches on a second bus wiring region 73bA or on a second bus wiring pattern 73b, discharge of the paste 7 from the first nozzle 47 is stopped. <P>COPYRIGHT: (C)2012,JPO&INPIT |
