| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a compact size and thin flip-chip package structure achieving high heat dissipation by low cost means and a manufacturing method of the same. <P>SOLUTION: A flip-chip package structure in which a semiconductor element and a wiring board are bonded via bumps, comprises a land provided on a face facing the semiconductor element of the wiring board and a metal component provided on the land. The metal component contacts a part of a surface of the semiconductor element. A manufacturing method of the flip-chip package structure comprises heating the wiring board up above a melting point of the metal component, and bonding the semiconductor element and the wiring board via the bumps with the metal component provided on the land melting. <P>COPYRIGHT: (C)2012,JPO&INPIT |
