LED PACKAGE AND METHOD THEREOF

摘要

PURPOSE: An LED package and a method thereof are provided to minimize light loss by providing a light reflective resin portion to a chip mounting region of a package body with the mixture of radial powder and a transparent resin. CONSTITUTION: A package body(10) has a chip mounting region. First and second lead frames(20a,20b) are installed on the package body. A light emitting diode chip(40) is electrically connected to the first and second lead frames. A Zener diode chip(50) is loaded on a region exposed to the chip mounting region of the second lead frame. Light reflective resin portions(60a,60b) are made of the mixture of a transparent resin and radial powder.