FLEXIBLE MULTI LAYER TYPE THIN FILM CAPACITOR AND EMBEDDED PRINTED CIRCUIT BOARD USING THE SAME

摘要

PURPOSE: An embedded printed circuit board using a flexible multi-layer type thin film capacity is provided to prevent the generation of cracks caused by bending of a printed circuit board, thereby improve the reliability of a product. CONSTITUTION: A metal-oxide layer(12) is formed in a front side of a metallic board(11). A plurality of first inner electrode layers(13) is selectively spread on a first surface of the metallic board by using the metal material. A plurality of dielectric layers(14) is successively laminated on a front side of a first inner electrode layer by using the induced electricity material. A plurality of second inner electrode layers(15) is selectively spread on the dielectric layer by using the metal material A protective layer(16) is spread a surface of one among a plurality of second inner electrode layers. A pair of outer electrodes(17,18) is respectively connected to a plurality of the first inner electrode layers and the plurality of second inner electrode layers.