REDUCED NUMBER OF MASKS FOR IC DEVICE WITH STACKED CONTACT LEVELS

摘要

PURPOSE: A reduced number of masks for an IC(Integrated Circuit) device is provided to reduce manufacturing costs by reducing a necessary region for forming a plurality of contact levels. CONSTITUTION: A mounting portion of contact levels(160-1-160-4) is provided to an interconnection region. Only a set of etched masks of N is used to generate the layers of 2N of an interconnection contact region on the mounting portion of contact levels. A partial region is removed from any upper layer covering an upper portion of the mounting portion of contact levels in the interconnection region. Contact openings which are extended from a surface film to s each contact level are generated by etching the interconnection region at N times by using masks in a selected order and providing access to landing regions(161-1a, 161-1b).