| 摘要 |
The invention relates to components provided in ceramic housings for large chips. Provided is an electronic component including an integrated-circuit chip (30) mounted in a recess of a ceramic housing (10), wherein the recess includes a first planar area (Z1) which finished by grinding and onto which the chip is adhered, a second planar area (Z2) surrounding the first area and located slightly above the first area, a third planar area (Z3) located along one side of the chip and provided with screen-printed electric connection pads (120) onto which the ends of connection wires (130) for connecting the chip to the housing are welded. The third area (Z3) is at the same height as the second area, and a trench (150), the bottom of which is deeper than the level of the first area, which completely separates the second and third areas along said side. It is then possible to use shorter connection wires without running the risk of damaging the connection pads with the solvents of the adhesive.
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