发明名称 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND METHOD FOR FABRICATING LIGHT EMITTING DEVICE
摘要 PURPOSE: A light emitting device, a light emitting device package, and a method for manufacturing the light emitting device are provided to efficiently remove a threading dislocation by forming a groove on a patterned protrusion unit. CONSTITUTION: The first conductive semiconductor layer(11) is formed on a substrate(10). An active layer(12) is formed on the first conductive semiconductor layer. The second conductive semiconductor layer(13) is formed on the active layer. A transmitting electrode(14) is formed on the second conductive semiconductor layer. The second electrode(16) is formed on the transmitting electrode. A groove passes through the transmitting electrode, the second conductive semiconductor layer and the active layer.
申请公布号 KR20120086449(A) 申请公布日期 2012.08.03
申请号 KR20110007680 申请日期 2011.01.26
申请人 LG INNOTEK CO., LTD. 发明人 JANG, KEE YOUN;JEONG, DAE SOO
分类号 H01L33/20;H01L33/22 主分类号 H01L33/20
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