| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board for a probe card which has a surface wiring layer having high adhesive strength to an insulting substrate formed of a sintered mullite-based body, and the probe card using the same. <P>SOLUTION: In the wiring board for a probe card including an insulating substrate 11 of which at least ceramic insulating layers 11a and 11d on an outermost layer are formed of sintered mullite-based bodies, a via conductor 14 provided in at least the inside of the ceramic insulating layers 11a and 11d on the outermost layer, and a surface wiring layer 13 which is connected to the via conductor 14, has a larger area than that of the via conductor 14 in a plan view of the insulating substrate 11 and is formed of a metal film provided on the surface of the insulating substrate 11, the via conductor 14 contains at least one kind of metal of molybdenum and tungsten as a main component, the ceramic insulating layers 11a and 11d on the outermost layer have a first region 11A in the periphery of the via conductor 14 and a second region 11B other than the first region 11A, and the first region 11A has a larger amount of alumina with respect to mullite than that of the second region 11B. <P>COPYRIGHT: (C)2012,JPO&INPIT |
