发明名称 MANUFACTURING METHOD OF WIRING BOARD AND WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a highly-reliable wiring board in which occurrence of a migration phenomenon is suppressed and occurrence of a conduction failure is prevented, and to provide a manufacturing method capable of efficiently manufacturing the wiring board. <P>SOLUTION: A manufacturing method of a wiring board comprises: a ceramic compact formation step of forming a plurality of ceramic compacts composed of a ceramic material and a material including a glass powder and a binder; a conductor pattern precursor formation step of forming a conductor pattern precursor on the ceramic compacts by discharging an ink for forming a conductor pattern including a metal particle, a dispersion medium in which the metal particle disperses, and an organic substance in a droplet discharge method; a lamination step of obtaining a laminate by laminating the plurality of the ceramic compacts on which the conductor pattern precursor is formed; and a sintering step of sintering the laminate under an atmosphere where an oxygen concentration is lower than or equal to 18%. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012151302(A) 申请公布日期 2012.08.09
申请号 JP20110009165 申请日期 2011.01.19
申请人 SEIKO EPSON CORP 发明人 TOYODA NAOYUKI;TANABE KENTARO;HAMA YOSHIKAZU
分类号 H05K3/10;H05K3/12;H05K3/46 主分类号 H05K3/10
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