| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid state imaging element of a three-dimensional structure, which can ensure a joint area between electrodes, in a structure in which a sensor substrate and a circuit substrate are bonded between the electrodes. <P>SOLUTION: A solid state imaging element 1 comprises a sensor substrate 2 on which photoelectric converting portions 21 are aligned and formed; a circuit substrate 7 formed with a circuit for driving the photoelectric converting portions 21, and laminated on the sensor substrate 2; a sensor side electrode 45 drawn to an interface on the circuit substrate 7 side on the sensor substrate 2; and a circuit side electrode 65 drown to an interface on the sensor substrate 2 side on the circuit substrate 7. The sensor side electrode 45 and the circuit side electrode 65 are bonded while a projecting type electrode is fitted with a recessed type electrode. <P>COPYRIGHT: (C)2012,JPO&INPIT |
