| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate for a power module which reduces warpage occurring during joining and improves joining reliability even when the same material is used for forming metal layers in a case where the metal layers, having different thicknesses, are respectively laminated on both surfaces of a ceramic substrate. <P>SOLUTION: This invention relates to a manufacturing method of a substrate for a power module 3 in which metal layers 6, 7, having different thicknesses, are respectively laminated on both surfaces of a ceramic substrate 2. Both the metal layers 6, 7 are respectively disposed on the both surfaces of the ceramic substrate 2, and these components are heated to be joined. Then, the ceramic substrate with the metal layers 6, 7 is cooled to cause plastic deformation in the metal layers 6, 7. <P>COPYRIGHT: (C)2012,JPO&INPIT |
