| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a system and a method capable of improving alignment accuracy of LED package. <P>SOLUTION: An LED package includes a positional reference structure that is positioned outside of an insulating body of the LED package and has a known, fixed relationship to a heat sink. An LED die is mounted on the heat sink in such a manner that the LED die has a fixed relationship to the heat sink. Accordingly, the positional reference structure provides a reference of a frame at the position of the LED die within the LED package. The positional reference structure may be mounted to the heat sink or integrally formed from the heat sink. A pick-and-place head holds the LED package by engaging the positional reference structure, e.g., with an alignment pin. In addition, the LED package may include a lead wire that extends laterally into the insulating body, and extends towards the LED die to reduce the vertical distance between the lead wire and the LED die. <P>COPYRIGHT: (C)2012,JPO&INPIT |
