| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve productivity of a component mounter in which a process of removing and picking up dies from a dicing sheet, and a process of mounting the dies on a circuit board are performed by one component mounter. <P>SOLUTION: On a base pedestal 11 of a component mounter, a conveyor 13 transporting a circuit board 12 in a direction X, a wafer pallet set table 15 for setting a wafer pallet exchangeably, a die transfer stage 32 capable of loading a plurality of dies removed from a dicing sheet of the wafer pallet, and two X-Y robots 22, 23 are provided. Work heads 28, 29 are attached to the two X-Y robots 22, 23, respectively, and operations of picking up the die on the dicing sheet of the wafer pallet and loading the die on the die transfer stage 32 are repeatedly performed with the one work head 28, and the die on the die transfer stage 32 is picked up and mounted on the circuit board 12 with the other work head 29. <P>COPYRIGHT: (C)2012,JPO&INPIT |
