| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable an adhesive layer to sufficiently undergo hardening reaction when an irradiated body has the adhesive layer. <P>SOLUTION: A light irradiation device 10 includes: a table 11 supporting a semiconductor wafer W on which an adhesive sheet S configuring an irradiated body is stuck; emission means 12 for irradiating the adhesive sheet S with light; and displacement means 13 for relatively displacing the table 11 and the emission means 12. The emission means 12 includes: a plurality of light-emitting diodes 21 installed on a surface parallel to an irradiated surface S1 of the adhesive sheet S; and first lenses 22, second lenses 23, and light guide means 23 for converting light emitted by these light-emitting diodes 21 to rectangle parallel light and irradiating the irradiated surface S1 with it. The light emitted by each of the light-emitting diodes 21 is converted to that in a rectangular shape by the second lens 24 and guided by the light guide means 23. The guided light is refracted by the first lens 22 to be parallel light becoming belt-shaped light B extending in parallel in a direction intersecting the relative displacing direction. The irradiated surface S1 can be irradiated with the belt-shaped light B. <P>COPYRIGHT: (C)2012,JPO&INPIT |
